Tuesday, August 07, 2007

Assembly Outsourcing Completed


The outsourcing of the standard chip packaging to Asia is completed. The service providers in the Asian region have successfully fulfilled the high requirements. ELMOS subsidiary ELMOS Advanced Packaging in the Netherlands - as announced - now focuses its development and manufacture solely on special packages.

"With the outsourcing of the standard packaging completed according to plan, we can now fully concentrate on the next development stage of our subsidiary in the Netherlands", says Reinhard Senf, member of the board for production of ELMOS Semiconductor AG. "The cooperation with the service providers is proceeding without any problems. All qualification results fulfill the automotive quality standard. Our strategy to rely on long-term partners has proven itself."

Furthermore, ELMOS increases the amount of services acquired from within the Dollar area with this measure.

With ELMOS Advanced Packaging focusing on special packages, ELMOS fulfills customer requirements, as they are necessary e.g. for pressure measuring microsystems or optical sensors.

ELMOS Advanced Packaging has a long-term experience in the development and production of customer specific packages for silicon chips and sensors. In development and production it can rely on state-of-the-art technical qualifications.

ELMOS Semiconductor AG is a producer and developer of system solutions on semiconductor basis. For more than 20 years, roughly 90% of sales have been generated with chips for automotive electronics.